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SMT Assembly

ProductDetail

Quick Details

• Ball Grid Array (BGA)

• Ultra-Fine Ball Grid Array (uBGA)

• Quad Flat Pack No-Lead (QFN)

• Quad Flat Package (QFP)

• Small Outline Integrated Circuit (SOIC)

• Plastic Leaded Chip Carrier (PLCC)

• Package-On-Package (PoP)

• Small Chip Packages (pitch of 0.2 mm)

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okey@okpcb.cn


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